SiCarrier Unveils Ambitious Roadmap for ASML-Compatible Lithography Tools

SiCarrier announces plans to develop ASML-compatible lithography machines by 2026, with production for 300-mm wafers at 28nm already underway. The company is collaborating with multiple foundries and expanding research efforts. Established in 2022, SiCarrier has notable leadership and is involved with key industry players such as Huawei and state-backed entities.

SiCarrier gained significant attention at SEMICON China, revealing its strategic product roadmap for the semiconductor industry. The company, which specializes in chip equipment, has developed lithography machines suitable for 300-mm wafers employing 28nm processes. They aim to launch an upgraded version of these machines compatible with ASML and Applied Materials by the year 2026, as reported by Anue.

According to Zhao Min, SiCarrier’s Market Director, a dedicated team is focused on achieving full compatibility of their equipment with that used by domestic foundries. The firm, under the guidance of its CTO Chen Dong, is collaborating with several fabs to establish joint laboratories. They anticipate announcing their first commercial orders by the fourth quarter of 2025.

SiCarrier’s clientele includes prominent Chinese foundries such as SMIC and Hua Hong Group. The company has commenced production of etching equipment intended for power semiconductor lines. Furthermore, they plan to expand their research and development centers to more than ten cities over the next three years and establish service centers in Europe and Southeast Asia.

Founded in 2022, SiCarrier possesses a renowned background in the semiconductor sector. Dai Jun, the firm’s technology chief, also holds supervisory roles in China’s Big Fund II and serves on the board of SMIC. Earlier reports from Bloomberg indicate that SiCarrier operates as a state-backed semiconductor equipment developer in conjunction with Huawei.

SiCarrier made headlines in 2023 for acquiring a significant patent for manufacturing 5nm chips utilizing DUV tools, a milestone associated with Huawei’s 7nm chip for the Mate 60 Pro. At SEMICON China, SiCarrier showcased a comprehensive range of semiconductor manufacturing equipment, including metrology and inspection systems, although lithography tools remained unexhibited. Reports from Nikkei indicate the company already possesses lithography machines capable of processing 300-mm wafers at 28nm and previous process nodes.

Despite the absence of lithography machines on display, SiCarrier provides an extensive array of tools that cater to nearly every aspect of the front-end semiconductor production process. This suite of offerings also includes metrology, inspection, and testing equipment, affirming the company’s crucial role within the semiconductor industry.

In summary, SiCarrier has outlined an ambitious plan to introduce ASML-compatible lithography tools by 2026, marking a significant step forward in China’s semiconductor capabilities. The company is actively collaborating with local fabs, expanding its research facilities, and establishing international service centers. With its impressive background and strategic partnerships, SiCarrier is poised to impact the semiconductor manufacturing landscape substantially.

Original Source: www.trendforce.com